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Thermal and mechanical effects of voids within flip chip soldering in LED packages 期刊论文
MICROELECTRONICS RELIABILITY, 2014, 卷号: 54, 期号: 9-10, 页码: 2028-2033
Authors:  Liu, Y;  Leung, SYY;  Zhao, J;  Wong, CKY;  Yuan, CA;  Zhang, GQ;  Sun, FL;  Luo, LL
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