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中国科学院半导体研究所机构知识库
Knowledge Management System Of Institute of Semiconductors,CAS
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中国科学院半导体研究... [3]
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Patent [3]
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2006 [3]
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中文 [3]
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一种片状材料厚度测量装置
专利
专利类型: 发明, 申请日期: 2006-12-27, 公开日期: 2009-06-04, 2009-06-11
Inventors:
朱蓉辉
;
惠峰
;
卜俊鹏
;
郑红军
Adobe PDF(243Kb)
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View/Download：940/198
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Submit date：2009/06/11
一种晶片工艺卡具
专利
专利类型: 发明, 申请日期: 2006-12-27, 公开日期: 2009-06-04, 2009-06-11
Inventors:
朱蓉辉
;
惠峰
;
卜俊鹏
;
郑红军
Adobe PDF(345Kb)
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View/Download：913/209
|
Submit date：2009/06/11
多线切割载荷控制方法
专利
专利类型: 发明, 申请日期: 2006-12-27, 公开日期: 2009-06-04, 2009-06-11
Inventors:
朱蓉辉
;
惠峰
;
卜俊鹏
;
郑红军
Adobe PDF(289Kb)
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View/Download：1035/187
|
Submit date：2009/06/11
