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一种片状材料厚度测量装置
朱蓉辉; 惠峰; 卜俊鹏; 郑红军
2006-12-27
Date Available2009-06-04 ; 2009-06-11
Subtype发明
Application Date2005-06-20
Language中文
Application Number200510078612
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/3663
Collection中国科学院半导体研究所(2009年前)
Recommended Citation
GB/T 7714
朱蓉辉,惠峰,卜俊鹏,等. 一种片状材料厚度测量装置[P]. 2006-12-27.
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