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中国科学院半导体研究所机构知识库
Knowledge Management System Of Institute of Semiconductors,CAS
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半导体集成技术工程研... [2]
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材料扩散互溶实现碳化硅键合的方法
专利
专利类型: 发明, 公开日期: 2016-09-28
Inventors:
赵永梅
;
何志
;
季安
;
刘胜北
;
黄亚军
;
杨香
;
段瑞飞
;
张明亮
;
王晓东
;
杨富华
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Submit date：2016/09/28
一种利用金属材料扩散互溶实现硅-硅键合的方法
专利
专利类型: 发明, 公开日期: 2016-09-12
Inventors:
赵永梅
;
何志
;
季安
;
王晓峰
;
黄亚军
;
潘岭峰
;
樊中朝
;
王晓东
;
杨富华
Adobe PDF(392Kb)
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Submit date：2016/09/12
