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无权访问的条目 期刊论文
作者:  Chen XF;  Liu W;  An JM;  Liu Y;  Xu K;  Wang X;  Liu JG;  Ji YF;  Zhu NH;  Zhu, NH (reprint author), Chinese Acad Sci, Inst Semicond, Beijing 100083, Peoples R China, nhzhu@semi.ac.cn
Adobe PDF(840Kb)  |  收藏  |  浏览/下载:839/161  |  提交时间:2012/02/06
无权访问的条目 期刊论文
作者:  Zhu, NH;  Wen, JM;  Zhang, SJ;  Zhu, NH, Chinese Acad Sci, Inst Semicond, State Key Lab Integrated Opetoelect, POB 912, Beijing 100083, Peoples R China. 电子邮箱地址: nhzhu@semi.ac.cn
Adobe PDF(330Kb)  |  收藏  |  浏览/下载:918/319  |  提交时间:2010/03/08
Fabrication and characterization of TO packaged high-speed laser modules - art. no. 682407 会议论文
SEMICONDUCTOR LASERS AND APPLICATIONS III, Beijing, PEOPLES R CHINA, NOV 12-13, 2007
作者:  Wen, JM;  Liu, Y;  Wang, X;  Yuan, HQ;  Xie, L;  Zhu, NH;  Zhu, NH, Chinese Acad Sci, Inst Semicond, State Key Lab Integrated Optoelect, POB 912, Beijing 100083, Peoples R China.
Adobe PDF(163Kb)  |  收藏  |  浏览/下载:2023/508  |  提交时间:2010/03/09
Equivalent Circuits  Fp Laser Modules  Dfb Laser Modules  Vcsel Modules  Through Hole (To) Packaging  
无权访问的条目 期刊论文
作者:  Chen C (Chen Cheng);  Zhu NH (Zhu Ning Hua);  Zhang SJ (Zhang Shang Jian);  Liu Y (Liu Yu);  Chen, C, Chinese Acad Sci, Inst Semicond, State Key Lab Integrated Optoelect, Beijing 100083, Peoples R China.
Adobe PDF(570Kb)  |  收藏  |  浏览/下载:1131/524  |  提交时间:2010/03/29