Knowledge Management System Of Institute of Semiconductors,CAS
| 用于电吸收调制半导体激光器高频封装的热沉 | |
| 李宝霞; 张靖; 杨华; 王圩 | |
| 2007-02-21 | |
| Date Available | 2009-06-04 ; 2009-06-11 |
| Subtype | 发明 |
| Application Date | 2005-08-18 |
| Language | 中文 |
| Application Number | 200510090643 |
| Document Type | 专利 |
| Identifier | http://ir.semi.ac.cn/handle/172111/3609 |
| Collection | 中国科学院半导体研究所（2009年前） |
| Recommended Citation GB/T 7714 | 李宝霞,张靖,杨华,等. 用于电吸收调制半导体激光器高频封装的热沉[P]. 2007-02-21. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| 200510090643.pdf（469KB） | 限制开放 | -- | Application Full Text | |||
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