| LED芯片的封装方法 | |
| 卢鹏志; 杨华; 薛斌; 王晓桐; 王琳琳; 李璟; 伊晓燕; 王国宏; 王军喜 | |
| Rights Holder | 中国科学院半导体所 |
| Date Available | 2016-09-28 |
| Country | 中国 |
| Subtype | 发明 |
| Subject Area | 半导体器件 |
| Application Date | 2015-01-07 |
| Application Number | CN201510006030.8 |
| Document Type | 专利 |
| Identifier | http://ir.semi.ac.cn/handle/172111/27621 |
| Collection | 中科院半导体照明研发中心 |
| Recommended Citation GB/T 7714 | 卢鹏志,杨华,薛斌,等. LED芯片的封装方法. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| LED芯片的封装方法.pdf（285KB） | 限制开放 | License | Application Full Text | |||
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