银铜扩散焊接方法及焊接装置 | |
刘媛媛; 柳瑞从; 杨富华 | |
Rights Holder | 中国科学院半导体所 |
Date Available | 2016-09-22 |
Country | 中国 |
Subtype | 发明 |
Subject Area | 微电子学 |
Application Date | 2055-05-14 |
Application Number | CN201510245600.9 |
Document Type | 专利 |
Identifier | http://ir.semi.ac.cn/handle/172111/27521 |
Collection | 半导体集成技术工程研究中心 |
Recommended Citation GB/T 7714 | 刘媛媛,柳瑞从,杨富华. 银铜扩散焊接方法及焊接装置. |
Files in This Item: | ||||||
File Name/Size | DocType | Version | Access | License | ||
银铜扩散焊接方法及焊接装置.pdf(742KB) | 限制开放 | License | Application Full Text |
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment