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银铜扩散焊接方法及焊接装置
刘媛媛; 柳瑞从; 杨富华
Rights Holder中国科学院半导体所
Date Available2016-09-22
Country中国
Subtype发明
Subject Area微电子学
Application Date2055-05-14
Application NumberCN201510245600.9
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/27521
Collection半导体集成技术工程研究中心
Recommended Citation
GB/T 7714
刘媛媛,柳瑞从,杨富华. 银铜扩散焊接方法及焊接装置.
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