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Reduction in crystallographic tilt of lateral epitaxial overgrown GaN by using new patterned shape mask | |
Feng G; Shen XM; Zhu JJ; Zhang BS; Yang H; Liang JW; Feng G Chinese Acad Sci Inst Semicond State Key Lab Integrated Optoelect POB 912 Beijing 100083 Peoples R China. | |
2003 | |
会议名称 | 5th International Conference on Nitride Semiconductors (ICNS-5) |
会议录名称 | 5TH INTERNATIONAL CONFERENCE ON NITRIDE SEMICONDUCTORS (ICNS-5), PROCEEDINGS |
页码 | 2167-2170 |
会议日期 | MAY 25-30, 2003 |
会议地点 | NARA, JAPAN |
出版地 | 605 THIRD AVE, NEW YORK, NY 10158-0012 USA |
出版者 | WILEY-VCH, INC |
ISBN | 3-527-40489-9 |
部门归属 | chinese acad sci, inst semicond, state key lab integrated optoelect, beijing 100083, peoples r china |
摘要 | We proposed a new method to suppress the crystallographic tilt in the lateral epitaxial overgrowth of GaN by using an oxide mask with a newly designed pattern. A rhombus mask with edges oriented in the direction of <10 - 10>(GaN) was used instead of the traditional stripe mask. The morphology evolution during the LEO GaN with the rhombus mask was investigated by SEM, and the crystallographic tilt in the LEO GaN was measured by DC-XRD. It is found that using the new rhombus mask can decrease the crystallographic tilt in the LEO GaN. In addition, this method makes the ELO GaN stripes easy to coalesce. (C) 2003 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. |
关键词 | Buffer Layer Substrate Diodes Growth |
学科领域 | 光电子学 |
主办者 | Japan Soc Appl Phys.; Japan Soc Promot Sci, 162nd Comm Wide Bandgap Semiconductor Photon & Elect Devices.; Japan Assoc Crystal Growth.; Elect Soc. |
收录类别 | CPCI-S |
语种 | 英语 |
文献类型 | 会议论文 |
条目标识符 | http://ir.semi.ac.cn/handle/172111/13563 |
专题 | 中国科学院半导体研究所(2009年前) |
通讯作者 | Feng G Chinese Acad Sci Inst Semicond State Key Lab Integrated Optoelect POB 912 Beijing 100083 Peoples R China. |
推荐引用方式 GB/T 7714 | Feng G,Shen XM,Zhu JJ,et al. Reduction in crystallographic tilt of lateral epitaxial overgrown GaN by using new patterned shape mask[C]. 605 THIRD AVE, NEW YORK, NY 10158-0012 USA:WILEY-VCH, INC,2003:2167-2170. |
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