Knowledge Management System Of Institute of Semiconductors,CAS
The effect of Fabry-Perot interference on the packaging of SOI-based optoelectronic devices | |
Xin HL; Chen P; Li F; Wang CX; Cao P; Liu YL; Xin, HL, Chinese Acad Sci, Inst Semicond, Res & Dev Ctr Optoelect, Beijing 100083, Peoples R China. | |
2004 | |
Conference Name | 7th International Conference on Solid-State and Integrated Circuits Technology |
Source Publication | 2004 7TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUITS TECHNOLOGY |
Pages | VOLS 1- 3 PROCEEDINGS: 2021-2024 |
Conference Date | OCT 18-21, 2004 |
Conference Place | Beijing, PEOPLES R CHINA |
Publication Place | 345 E 47TH ST, NEW YORK, NY 10017 USA |
Publisher | IEEE |
ISBN | 0-7803-8511-X |
metadata_83 | chinese acad sci, inst semicond, res & dev ctr optoelect, beijing 100083, peoples r china |
Abstract | During the packaging of optoelectrome device, a problem always met is the instability of output power. The main effect causing this problem, Fabry-Perot interference, is discussed in this paper. Both theoretical analysis and experimental test are carried out and in good agreement. As an example of avoiding the disadvantage of Fabry-Perot interference, the packaging process of Silicon-on-Insulator (SOI) based Variable Optical Attenuator(VOA) is shown at last. |
Subject Area | 光电子学 |
Funding Organization | Chinese Inst Elect.; IEEE Beijing Sect.; IEEE Elect Devices Soc.; IEEE EDS Beijing Chapter.; IEEE Solid-State Circuits Soc.; IEEE SSCS Beijing Chapter.; Japan Soc Appl Phys.; IEE Elect Div.; URSI Commiss D.; Inst Elect Engineers Korea.; Natl Nat Sci Fdn China.; Beijing Municipal Bureau Ind Dev.; Peking Univ. |
Indexed By | 其他 |
Language | 英语 |
Document Type | 会议论文 |
Identifier | http://ir.semi.ac.cn/handle/172111/10104 |
Collection | 中国科学院半导体研究所(2009年前) |
Corresponding Author | Xin, HL, Chinese Acad Sci, Inst Semicond, Res & Dev Ctr Optoelect, Beijing 100083, Peoples R China. |
Recommended Citation GB/T 7714 | Xin HL,Chen P,Li F,et al. The effect of Fabry-Perot interference on the packaging of SOI-based optoelectronic devices[C]. 345 E 47TH ST, NEW YORK, NY 10017 USA:IEEE,2004:VOLS 1- 3 PROCEEDINGS: 2021-2024. |
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