Fabrication and characterization of TO packaged high-speed laser modules - art. no. 682407
Wen, JM; Liu, Y; Wang, X; Yuan, HQ; Xie, L; Zhu, NH; Zhu, NH, Chinese Acad Sci, Inst Semicond, State Key Lab Integrated Optoelect, POB 912, Beijing 100083, Peoples R China.
2008
会议名称Conference on Semiconductor Lasers and Applications III
会议录名称SEMICONDUCTOR LASERS AND APPLICATIONS III
页码6824: 82407-82407
会议日期NOV 12-13, 2007
会议地点Beijing, PEOPLES R CHINA
出版地1000 20TH ST, PO BOX 10, BELLINGHAM, WA 98227-0010 USA
出版者SPIE-INT SOC OPTICAL ENGINEERING
ISSN0277-786X
ISBN978-0-8194-6999-1
部门归属[wen, ji min; liu, yu; wang, xin; yuan, hai qing; xie, liang; zhu, ning hua] chinese acad sci, inst semicond, state key lab integrated optoelect, beijing 100083, peoples r china
摘要Various high-speed laser modules are fabricated by TO-Packaged processes, such as FP laser modules, DFB laser modules, and VCSEL modules. Furthermore,, the resonance among the circuit elements provides an approach to compensating the TO packaging parasitics, and improving the frequency response of the devices. The detailed equivalent circuit model is established to investigate both the laser diode and packaging comprehensively. The small-signal modulation bandwidths of the TO packaged FP laser, DFB laser and the VCSEL modules are more than 10, 9.7 and 8 GHz, respectively.
关键词Equivalent Circuits Fp Laser Modules Dfb Laser Modules Vcsel Modules Through Hole (To) Packaging
学科领域光电子学
主办者SPIE.; Chinese Opt Soc.
收录类别CPCI-S
语种英语
文献类型会议论文
条目标识符http://ir.semi.ac.cn/handle/172111/7854
专题中国科学院半导体研究所(2009年前)
通讯作者Zhu, NH, Chinese Acad Sci, Inst Semicond, State Key Lab Integrated Optoelect, POB 912, Beijing 100083, Peoples R China.
推荐引用方式
GB/T 7714
Wen, JM,Liu, Y,Wang, X,et al. Fabrication and characterization of TO packaged high-speed laser modules - art. no. 682407[C]. 1000 20TH ST, PO BOX 10, BELLINGHAM, WA 98227-0010 USA:SPIE-INT SOC OPTICAL ENGINEERING,2008:6824: 82407-82407.
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