SEMI OpenIR  > 中国科学院半导体研究所(2009年前)
精密多线切割和研磨用切磨粉体材料
朱蓉辉; 惠峰; 卜俊鹏; 郑红军
2007-05-30
Date Available2009-06-04 ; 2009-06-11
Subtype发明
Application Date2005-11-23
Language中文
Application Number200510086961
Document Type专利
Identifierhttp://ir.semi.ac.cn/handle/172111/3705
Collection中国科学院半导体研究所(2009年前)
Recommended Citation
GB/T 7714
朱蓉辉,惠峰,卜俊鹏,等. 精密多线切割和研磨用切磨粉体材料[P]. 2007-05-30.
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