Multiple quantum well self electro-optic effect devices for optoelectronic smart pixels

SEMI OpenIR > 中国科学院半导体研究所（2009年前）

	Multiple quantum well self electro-optic effect devices for optoelectronic smart pixels
	Chen HD; Wu RG; Chen ZB; Zhang Y; Du Y; Zeng QM; Li XJ; Zhang YM; Zhou G; Hua F; Chen HD Chinese Acad Sci Inst Semicond Beijing 100083 Peoples R China.
	1999
会议名称	Conference on Optoelectronic Integrated Circuits and Packaging III
会议录名称	OPTOELETRONIC INTEGRATED CIRCUITS AND PACKAGING III, 3631
页码	55-63
会议日期	JAN 28-29, 1999
会议地点	SAN JOSE, CA
出版地	1000 20TH ST, PO BOX 10, BELLINGHAM, WA 98227-0010 USA
出版者	SPIE-INT SOC OPTICAL ENGINEERING
ISSN	0277-786X
ISBN	0-8194-3101-X
部门归属	chinese acad sci, inst semicond, beijing 100083, peoples r china
摘要	The investigations on GaAs/AlGaAs multiple quantum well self electro-optic effect device (SEED) arrays for optoelectronic smart pixels are reported. The hybrid integration of GaAs/AlGaAs multiple quantum well devices flip-chip bonding directly over 1 mu m silicon CMOS circuits are demonstrated. The GaAs/AlGaAs multiple quantum well devices are designed for 850nm operation. The measurement results under applied biases show the good optoelectronic characteristics of elements in SEED arrays. The 4x4 optoelectronic crossbar structure consisting of hybrid CMOS-SEED smart pixels have been designed, which could be potentially used in optical interconnects for multiple processors.
关键词	Seed Arrays Smart Pixels Hybrid Integration Optical Interconnects Vlsi Switching Chip Mqw Modulators Silicon Cmos Circuits Arrays Operation Detectors Receivers Progress
学科领域	光电子学
主办者	SPIE.; Def Adv Res Projects Agnecy.
收录类别	CPCI-S
语种	英语
文献类型	会议论文
条目标识符	http://ir.semi.ac.cn/handle/172111/13811
专题	中国科学院半导体研究所（2009年前）
通讯作者	Chen HD Chinese Acad Sci Inst Semicond Beijing 100083 Peoples R China.
推荐引用方式 GB/T 7714	Chen HD,Wu RG,Chen ZB,et al. Multiple quantum well self electro-optic effect devices for optoelectronic smart pixels[C]. 1000 20TH ST, PO BOX 10, BELLINGHAM, WA 98227-0010 USA:SPIE-INT SOC OPTICAL ENGINEERING,1999:55-63.

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